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Encapsulation/Potting of electronic circuits and devices Encapsulation/Potting Capabilities

Encapsulation/Potting of electronic circuits and devices

MEC provides electronic design and contract manufacturing services for potted (encapsulated) electronic devices. Our potting equipment can provide programmable shot sizes to meet your design specifications and protect your valuable circuits from the elements, shock, or vibration. We offer three different standard encapsulation (potting) compounds to cover a wide range of industrial and heave duty applications.

Equipment and Materials

  • Two Ashby Cross 2500 Series Double Acting Machines for epoxy and urethane
  • One Ashby Cross Single Acting Machine for silicone
  • One Seelant Equipment CS EE Flow 7 Machine for urethane
  • Liquid Control Corporation Posi dot Machine for epoxy

 

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Box Build
Eliminate another step in the manufacturing process by having completed boxes assembled to your own specifications. Buy 1 part number, not 100.
More info Box Build

ROHS Compliance Solutions
ROHS White PapersDownload our white paper here - ROHS Compliance Solutions for PCB Assembly from MEC.
More Info

 

MEC Midwest/MEC Innovation
Milwaukee, Wisconsin
Tel (414) 228-5000
Toll-free (877) 632 4863

MEC Northwest
Canby, Oregon
Tel (503) 263-7300

MEC Southwest
Tecate, Mexico
Tel (619) 446-6350

Screaming Circuits
Canby, Oregon
Tel (866) 784-5887

 ISO 9001: 2000

sales@meccompanies.com

Contact us for your product development, rapid prototyping, EMS contract manufacturing, electronic manufacturing, printed circuit board manufacturing, pcb assembly, pcb design and pcb layout needs now!